Samsung has decided to step into the next generation of packaging technology as the firm initiates R&D work for "Glass Substrate" adoption by 2026. Samsung Sees Glass Substrates As The Future of Chip Packaging, Expects It To Be Adopted Within Two Years The Glass Substrate technology isn't entirely new for the industry since the trend was initially set by none other than Intel a few years ago. While the company created hype for the technology's adoption, they won't be ready for mass production till 2030 despite investing around a billion dollars in their Arizona fab, and to fill this gap, […]
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