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Samsung’s Exynos 2500 Goes Official As The Company’s First 3nm GAA Chipset, Features A 10-Core CPU Cluster, New Powerful NPU, Advanced FOWLP Packaging And Much More

Samsung has officially announced the Exynos 2500

The 3nm GAA process is a memory that Samsung wishes it could erase from this timeline, but the company has seemingly defied all odds and managed to materialize the Exynos 2500, with the Korean giant putting up the newest details of its flagship chipset that will reportedly power the upcoming Galaxy Z Flip 7. Like the Exynos 2400, the new SoC will utilize a 10-core CPU cluster while also sporting Samsung’s improved FOWLP (fan-out wafer-level packaging), along with other upgrades. Here is more information that you would love to check out. On the specifications page, the Exynos 2500’s ‘Product Status’ […]

Read full article at https://wccftech.com/samsung-exynos-2500-goes-official-as-first-3nm-gaa-chipset/



from Wccftech https://ift.tt/d9kGHYe

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